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Profiletronic Series Forced Convection Ovens are designed for Pb-free reflow soldering process.
It has superior performance on not only the high heating capability but also low nitrogen
consumption, magnificent cooling rate, user friendly, gas and flux management, and lower man hour
maintenance. It is optimized for SMT, IC Bumping and Paclaging mass reflow slodering application.
Heater Module

•  Very higher thermal performance on uniformity and repeatability. Quick recipe exchange.

•  Auto cooling design provides longer working time blower motor .
•  Lifetime warranty on heaters and blower motors.
•  Option for KIC 24/7 profile monitoring system.
 
 
 
Cooling Module

•  Water cooling on N2 oven, cooling rate 2 ~ 4 ¢J/sec.

•  Air cooling on Air oven, cooling rate 2 ~ 4 ¢J/sec.
•  167 cm total cooling length for model:1204; Off-load PCB temperature can be as low as 50¢J.
•  Air / N2 knife provides thermal and flux barrier between heating and cooling zones.
 
Flux Management

•  Flux management : Gas with Flux will manage by our cooling tunnel 1 st before collection into our    collection box. No cleaning of internal heaters for 5 years.

•  Changing of flux filters will take only in 5 minutes and this is the lowest man hours in oven maintenance.
•  Metal filters can be re-used after washing. No additional exhaust material cost is require.
 
 
 
 
 
Nitrogen Management

•  Lowest N2 consumption ¡V is manage and enhance by closed loop N2 in our heating chamber.

•  Multi N2 flow meters adjustment. More flexible.
•  Flexible and fixed curtains at openings.
•  Option for O2 ppm analyzer.
 
 
 
Service & Maintainence

•  Fully vertical opening design with rigid bonnet for easier access during maintenance and long-term    sealing for N2 application .

•  Double rail width adjustment mechanism (1204 model) make sure the rails parallel.
•  Easy removable side panels.
•  24 hours technical service support ¡Vvia phone or on site .
 
 
Specifications